| Sensor | Sony IMX226 |
| Mono/Color | Color |
| Sensor type | 1/1.7″ CMOS |
| Shutter type | Rolling shutter, Global reset shutter |
| Resolution | 4000 × 3000 px |
| Pixel size | 1.85 × 1.85 µm |
| Exposure time | 0.0085 … 60000 ms |
| Dark noise | 2.99 e- |
| Saturation capacity | 10805 e- |
| Dynamic range | 69.5 dB |
| Signal-to-noise ratio | 40.3 dB |
| Image formats, interface frame rate max. | Full Frame, 4000 × 3000 px, max. 10 fps, Binning 2×2, 2000 × 1500 px, max. 15 fps, Binning 2×1, 2000 × 3000 px, max. 10 fps, Binning 1×2, 4000 × 1500 px, max. 15 fps |
| Image formats, aquisition frame rate max. (Burst Mode) | Full Frame, 4000 × 3000 px, max. 15 fps |
| Pixel formats | BayerRG8, BayerRG10, BayerRG12, BayerRG12 Packed, Mono8, Mono10, Mono12, Mono12 Packed, RGB8, BGR8 |
| Analog controls | Gain (0 … 20 dB), Offset (0 … 255 LSB 12 Bit) |
| Color models | Mono, Raw Bayer, RGB, BGR |
| Internal image buffer | 35 MB, 1 image (Trigger Mode), 1 image (Free Running Mode) |
| Process interface | M8 / 8 pins (SACC-DSI-M8MS-8CON-M8-L180) |
| Power supply | via M8/8 pins or Power over Ethernet (PoE) |
| Lens mount | C-mount |
| Width | 29 mm |
| Height | 29 mm |
| Depth | 49 mm |
| Weight | ≤ 120 g |
| Material | zinc die casting, baked varnish (until 02-2020 nickel-chrome-plated), IP 40 |
| Voltage supply range +Vs | 12 … 24 V DC (external power supply), 36 … 57 V DC (Power over Ethernet) |
| Power consumption | Approx. 2.2 W @ 12 VDC and 10 fps, Approx. 2.7 W @ 48 VDC (PoE) and 10 fps |
| Flash memory size | 128 kB |
| Operating temperature | 0 … +65 ° @ T = measurement point |
| Storage temperature | -20 … +70 °C |
| Humidity | 0 … 90 % (non-condensing) |
| Protection class | IP 40 (with mounted lens and cable) |
